In-Substrate Resonators and Bandpass Filters with Improved Insertion Loss in K-Band Utilizing Low Loss Glass Interposer Technology and Superlattice Conductors
In this work, we report on in-substrate passive components using a high performance glass interposer and through glass via (TGV) technology and a multi-layer superlattice conductor architecture. Minimal RF loss is achieved using low dielectric loss glass substrates and superlattice conductors featur...
- Autores:
- Tipo de recurso:
- Fecha de publicación:
- 2016
- Institución:
- Universidad Tecnológica de Bolívar
- Repositorio:
- Repositorio Institucional UTB
- Idioma:
- eng
- OAI Identifier:
- oai:repositorio.utb.edu.co:20.500.12585/8982
- Acceso en línea:
- https://hdl.handle.net/20.500.12585/8982
- Palabra clave:
- Complementary split ring resonator
Cu/NiFe nano-superlattice conductors
Glass interposer technology
Skin effect suppression
Through glass via
Bandpass filters
Dielectric losses
Eddy current testing
Glass
Insertion losses
Network components
Optical resonators
Resonators
Substrate integrated waveguides
Waveguide filters
Waveguides
Complementary split ring resonators
Conductor architectures
Glass substrates
Half-mode substrate integrated waveguides
Low dielectric loss
Negative permeability
Superlattice approach
Through glass via
Substrates
- Rights
- restrictedAccess
- License
- http://creativecommons.org/licenses/by-nc-nd/4.0/
| Summary: | In this work, we report on in-substrate passive components using a high performance glass interposer and through glass via (TGV) technology and a multi-layer superlattice conductor architecture. Minimal RF loss is achieved using low dielectric loss glass substrates and superlattice conductors featuring skin effect suppression. Half mode substrate integrated waveguide (HMSIW) resonators and two-pole bandpass filters, embedded inside a glass interposer substrate, are used as test vehicles for the demonstration of insertion loss improvement in K-band. The utilized conductor is made of 20 layers of Cu/NiFe with each pair of 360 nm/30 nm, respectively, where NiFe layers with negative permeability in frequency range of interest are used for eddy current cancelling and improving the conductor loss. Control devices using the same glass substrate and conductor made of pure copper are fabricated for comparison purposes. The glass interposer substrate (SGW3, Corning Incorporated) has a thickness of 0.13 mm and the TGV's with a diameter of 0.08 mm. Up to 0.3 dB reduction in the insertion loss is achieved by using the proposed superlattice approach on glass substrates. © 2016 IEEE. |
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