In-Substrate Resonators and Bandpass Filters with Improved Insertion Loss in K-Band Utilizing Low Loss Glass Interposer Technology and Superlattice Conductors

In this work, we report on in-substrate passive components using a high performance glass interposer and through glass via (TGV) technology and a multi-layer superlattice conductor architecture. Minimal RF loss is achieved using low dielectric loss glass substrates and superlattice conductors featur...

Full description

Autores:

Tipo de recurso:

Fecha de publicación:

2016

Institución:

Universidad Tecnológica de Bolívar

Repositorio:

Repositorio Institucional UTB

Idioma:

eng

OAI Identifier:

oai:repositorio.utb.edu.co:20.500.12585/8982

Acceso en línea:

https://hdl.handle.net/20.500.12585/8982

Palabra clave:

Complementary split ring resonator
Cu/NiFe nano-superlattice conductors
Glass interposer technology
Skin effect suppression
Through glass via
Bandpass filters
Dielectric losses
Eddy current testing
Glass
Insertion losses
Network components
Optical resonators
Resonators
Substrate integrated waveguides
Waveguide filters
Waveguides
Complementary split ring resonators
Conductor architectures
Glass substrates
Half-mode substrate integrated waveguides
Low dielectric loss
Negative permeability
Superlattice approach
Through glass via
Substrates

Rights

restrictedAccess

License

http://creativecommons.org/licenses/by-nc-nd/4.0/