Measuring material thickness changes through tri-aperture digital speckle pattern interferometry

A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, in...

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Autores:
Sánchez Barrera, Estiven
Ealo Cuello, Joao Luis
Tipo de recurso:
Fecha de publicación:
2023
Institución:
Universidad Tecnológica de Bolívar
Repositorio:
Repositorio Institucional UTB
Idioma:
eng
OAI Identifier:
oai:repositorio.utb.edu.co:20.500.12585/12386
Acceso en línea:
https://hdl.handle.net/20.500.12585/12386
Palabra clave:
Shearography;
Speckle Patterns;
Interferometry
LEMB
Rights
openAccess
License
http://creativecommons.org/licenses/by-nc-nd/4.0/
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dc.title.spa.fl_str_mv Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
title Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
spellingShingle Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
Shearography;
Speckle Patterns;
Interferometry
LEMB
title_short Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
title_full Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
title_fullStr Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
title_full_unstemmed Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
title_sort Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
dc.creator.fl_str_mv Sánchez Barrera, Estiven
Ealo Cuello, Joao Luis
dc.contributor.author.none.fl_str_mv Sánchez Barrera, Estiven
Ealo Cuello, Joao Luis
dc.subject.keywords.spa.fl_str_mv Shearography;
Speckle Patterns;
Interferometry
topic Shearography;
Speckle Patterns;
Interferometry
LEMB
dc.subject.armarc.none.fl_str_mv LEMB
description A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm-thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes to 2 μm were measured. © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).
publishDate 2023
dc.date.accessioned.none.fl_str_mv 2023-07-21T20:49:23Z
dc.date.available.none.fl_str_mv 2023-07-21T20:49:23Z
dc.date.issued.none.fl_str_mv 2023
dc.date.submitted.none.fl_str_mv 2023
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dc.identifier.citation.spa.fl_str_mv Barrera, E. S., & Cuello, J. L. E. (2023). Measuring material thickness changes through tri-aperture digital speckle pattern interferometry. Optical Engineering, 62(1), 014108-014108.
dc.identifier.uri.none.fl_str_mv https://hdl.handle.net/20.500.12585/12386
dc.identifier.doi.none.fl_str_mv 10.1117/1.OE.62.1.014108
dc.identifier.instname.spa.fl_str_mv Universidad Tecnológica de Bolívar
dc.identifier.reponame.spa.fl_str_mv Repositorio Universidad Tecnológica de Bolívar
identifier_str_mv Barrera, E. S., & Cuello, J. L. E. (2023). Measuring material thickness changes through tri-aperture digital speckle pattern interferometry. Optical Engineering, 62(1), 014108-014108.
10.1117/1.OE.62.1.014108
Universidad Tecnológica de Bolívar
Repositorio Universidad Tecnológica de Bolívar
url https://hdl.handle.net/20.500.12585/12386
dc.language.iso.spa.fl_str_mv eng
language eng
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dc.rights.accessrights.spa.fl_str_mv info:eu-repo/semantics/openAccess
dc.rights.cc.*.fl_str_mv Attribution-NonCommercial-NoDerivatives 4.0 Internacional
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-nd/4.0/
Attribution-NonCommercial-NoDerivatives 4.0 Internacional
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eu_rights_str_mv openAccess
dc.format.mimetype.spa.fl_str_mv application/pdf
dc.publisher.place.spa.fl_str_mv Cartagena de Indias
dc.source.spa.fl_str_mv Optical Engineering
institution Universidad Tecnológica de Bolívar
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spelling Sánchez Barrera, Estiven338ae022-97b6-407e-b53b-4fe8139105b7Ealo Cuello, Joao Luis2b294d78-0375-4f1b-98d7-447243ee1d5d2023-07-21T20:49:23Z2023-07-21T20:49:23Z20232023Barrera, E. S., & Cuello, J. L. E. (2023). Measuring material thickness changes through tri-aperture digital speckle pattern interferometry. Optical Engineering, 62(1), 014108-014108.https://hdl.handle.net/20.500.12585/1238610.1117/1.OE.62.1.014108Universidad Tecnológica de BolívarRepositorio Universidad Tecnológica de BolívarA configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm-thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes to 2 μm were measured. © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).application/pdfenghttp://creativecommons.org/licenses/by-nc-nd/4.0/info:eu-repo/semantics/openAccessAttribution-NonCommercial-NoDerivatives 4.0 Internacionalhttp://purl.org/coar/access_right/c_abf2Optical EngineeringMeasuring material thickness changes through tri-aperture digital speckle pattern interferometryinfo:eu-repo/semantics/articleinfo:eu-repo/semantics/drafthttp://purl.org/coar/resource_type/c_6501http://purl.org/coar/version/c_b1a7d7d4d402bccehttp://purl.org/coar/resource_type/c_2df8fbb1Shearography;Speckle Patterns;InterferometryLEMBCartagena de IndiasGeorges, M.P., Thizy, C., Languy, F., Vandenrijt, J.-F. An overview of interferometric metrology and NDT techniques and applications for the aerospace industry (2016) Proceedings of SPIE - The International Society for Optical Engineering, 9960, art. no. 996007. Cited 12 times. http://spie.org/x1848.xml ISBN: 978-151060311-0 doi: 10.1117/12.2240676Viotti, M.R., Albertazzi, A. Robust speckle metrology: Techniques for stress analysis and NDT (2014) Robust Speckle Metrology: Techniques for Stress Analysis and NDT, pp. 1-182. Cited 20 times. http://dx.doi.org/10.1117/3.1002651 ISBN: 978-162841319-9; 978-162841318-2 doi: 10.1117/3.1002651Wyant, J.C. Interferometry: Overview (2004) Encyclopedia of Modern Optics, Five-Volume Set, pp. 351-356. http://www.sciencedirect.com/science/book/9780123693952 ISBN: 978-012369395-2 doi: 10.1016/B0-12-369395-0/00693-XCreath, K., Schmit, J. N-ppoint spatial phase-measurement techniques for non-destructive testing (1996) Optics and Lasers in Engineering, 24 (5-6), pp. 365-379. Cited 60 times. doi: 10.1016/0143-8166(95)00096-8Takeda, Mitsuo, Ina, Hideki, Kobayashi, Seiji FOURIER-TRANSFORM METHOD OF FRINGE-PATTERN ANALYSIS FOR COMPUTER-BASED TOPOGRAPHY AND INTEFEROMETRY. (1982) Journal of the Optical Society of America, 72 (1), pp. 156-160. Cited 4142 times. doi: 10.1364/JOSA.72.000156Bhaduri, B., Tay, C.J., Quan, C. Direct measurement of curvature and twist using two-channel double-aperture digital shearography (2010) Optical Engineering, 49 (3), art. no. 033604. Cited 6 times. doi: 10.1117/1.3359470Barrera, E.S., Fantin, A.V., Willemann, D.P., Benedet, M.E., Albertazzi Gonçalves, A. Multiple-aperture one-shot shearography for simultaneous measurements in three shearing directions (2018) Optics and Lasers in Engineering, 111, pp. 86-92. Cited 25 times. doi: 10.1016/j.optlaseng.2018.07.018Yan, P., Sun, F., Dan, X., Zhao, Q., Wang, Y., Lu, Y. Spatial phase-shift digital shearography for simultaneous measurements in three shearing directions based on adjustable aperture multiplexing (Open Access) (2019) Optical Engineering, 58 (5), art. no. 054105. Cited 11 times. http://www.spie.org/x867.xml doi: 10.1117/1.OE.58.5.054105Dong, J., Wang, S., Lu, M., Jakobi, M., Liu, Z., Dong, X., Pöller, F., (...), Koch, A.W. Real-time dual-sensitive shearography for simultaneous in-plane and out-of-plane strain measurements (2019) Optics Express, 27 (3), pp. 3276-3283. Cited 15 times. https://www.osapublishing.org/oe/abstract.cfm?uri=oe-27-3-3276 doi: 10.1364/OE.27.003276Yan, P., Liu, X., Sun, F., Zhao, Q., Zhong, S., Wang, Y. Measurement of in-plane displacement in two orthogonal directions by digital speckle pattern interferometry (2019) Applied Sciences (Switzerland), 9 (18), art. no. 3882. Cited 5 times. https://res.mdpi.com/d_attachment/applsci/applsci-09-03882/article_deploy/applsci-09-03882.pdf doi: 10.3390/app9183882Block, B.-M., Mercorelli, P. Conceptual understanding of complex components and Nyquist-Shannon sampling theorem: A design based research in Engineering (Open Access) (2015) IEEE Global Engineering Education Conference, EDUCON, 2015-April, art. no. 7096011, pp. 462-470. Cited 10 times. http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6196361 ISBN: 978-147991908-6 doi: 10.1109/EDUCON.2015.7096011Bhaduri, B., Krishna Mohan, N., Kothiyal, M.P., Sirohi, R.S. Use of spatial phase shifting technique in digital speckle pattern interferometry (DSPI) and digital shearography (DS) (2006) Optics Express, 14 (24), pp. 11598-11607. Cited 101 times. http://www.opticsexpress.org/DirectPDFAccess/2CA1C49F-BDB9-137E-CEE545E9E80FADD8_119159.pdf?da=1&id=119159&seq=0&CFID=36181786&CFTOKEN=68294129 doi: 10.1364/OE.14.011598Chang, G.-W., Lin, Y.-H., Yeh, Z.-M. White liglit interferometric profile measurement system using spectral coherence (2007) Proceedings of SPIE - The International Society for Optical Engineering, 6463, art. no. 64630I. Cited 3 times. ISBN: 0819465763; 978-081946576-4 doi: 10.1117/12.700003Herráez, M.A., Burton, D.R., Lalor, M.J., Gdeisat, M.A. Fast two-dimensional phase-unwrapping algorithm based on sorting by reliability following a noncontinuous path (2002) Applied Optics, 41 (35), pp. 7437-7444. 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