Measuring material thickness changes through tri-aperture digital speckle pattern interferometry
A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, in...
- Autores:
-
Sánchez Barrera, Estiven
Ealo Cuello, Joao Luis
- Tipo de recurso:
- Fecha de publicación:
- 2023
- Institución:
- Universidad Tecnológica de Bolívar
- Repositorio:
- Repositorio Institucional UTB
- Idioma:
- eng
- OAI Identifier:
- oai:repositorio.utb.edu.co:20.500.12585/12386
- Acceso en línea:
- https://hdl.handle.net/20.500.12585/12386
- Palabra clave:
- Shearography;
Speckle Patterns;
Interferometry
LEMB
- Rights
- openAccess
- License
- http://creativecommons.org/licenses/by-nc-nd/4.0/