Highly compact surface micromachined metamaterial circuits using multilayers of low-loss Benzocyclobutene for microwave and millimeter wave applications

This work explores the implementation of highly compact three dimensional (3D) integrable metamaterial based transmission lines on a low resistivity CMOS grade silicon substrate for microwave and millimeter wave applications. The composite right-left handed (CRLH) architecture is able to be integrat...

Full description

Autores:

Tipo de recurso:

Fecha de publicación:

2012

Institución:

Universidad Tecnológica de Bolívar

Repositorio:

Repositorio Institucional UTB

Idioma:

eng

OAI Identifier:

oai:repositorio.utb.edu.co:20.500.12585/9093

Acceso en línea:

https://hdl.handle.net/20.500.12585/9093

Palabra clave:

Batch fabrication
Benzocyclobutene
Dielectric interlayers
Dual Band
Electromagnetic structure
Fabrication process
Finite-ground coplanar waveguides
Left handed
Low resistivity
Low temperatures
Meander inductors
Metal insulator metal capacitor (MIM)
Micromachined
Millimeter-wave applications
Multi-band operations
Multilayer fabrication
Multilayer surfaces
Multiple devices
Negative tones
On-wafer
Pass bands
Post-CMOS
RF-circuits
Silicon substrates
Simulations and measurements
Unit cells
Butenes
CMOS integrated circuits
Computer simulation
Coplanar waveguides
Electric lines
Fabrication
Metamaterials
Millimeter waves
Multilayers
Three dimensional computer graphics
Transmission line theory
MIM devices

Rights

restrictedAccess

License

http://creativecommons.org/licenses/by-nc-nd/4.0/