Physical-aware pattern selection for stuck-at faults

The stuck-at faults are basic faults that fail the chips. Various defects in the circuit can develop into stuck-at faults. To detect more defects caused by stuck-at faults, some of the fault sites may need to be detected multiple times. Thus, the existing pattern generation techniques provide N-dete...

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Autores:
Tipo de recurso:
Fecha de publicación:
2017
Institución:
Universidad Tecnológica de Bolívar
Repositorio:
Repositorio Institucional UTB
Idioma:
eng
OAI Identifier:
oai:repositorio.utb.edu.co:20.500.12585/8935
Acceso en línea:
https://hdl.handle.net/20.500.12585/8935
Palabra clave:
Defects
Testing
Basic faults
Characteristics of defect
Defect detection
Detecting defects
Pattern Generation
Pattern selection
Stuck-at faults
Test pattern selections
Fault detection
Rights
restrictedAccess
License
http://creativecommons.org/licenses/by-nc-nd/4.0/
Description
Summary:The stuck-at faults are basic faults that fail the chips. Various defects in the circuit can develop into stuck-at faults. To detect more defects caused by stuck-at faults, some of the fault sites may need to be detected multiple times. Thus, the existing pattern generation techniques provide N-detect ATPG, where each fault site would not be removed from the fault list before it is detected for N times. The "N" value is determined empirically by the criticality of the application. The N-detect test has been shown to have a higher quality of detecting defects. However, the traditional N-detect test does not necessarily exploit the localized characteristics of defects. In addition, it may result in a large number of patterns. In this paper, we present a test pattern selection procedure to optimize the N-detect pattern generation by differentiating the fault sites according to the physical details and generate patterns that have comparable defect detection quality with N-detect pattern generation. © 2017 IEEE.