Measuring material thickness variations through tri-aperture DSPI

A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, in...

Full description

Autores:
Sanchez Barrera, Estiven
Ealo Cuello, Joao Luis
Tipo de recurso:
Fecha de publicación:
2023
Institución:
Universidad Tecnológica de Bolívar
Repositorio:
Repositorio Institucional UTB
Idioma:
eng
OAI Identifier:
oai:repositorio.utb.edu.co:20.500.12585/12091
Acceso en línea:
https://hdl.handle.net/20.500.12585/12091
Palabra clave:
DSPI
Carrier Fringes
Fourier Transform Method
Multiple Aperture
Thickness Variations.
LEMB
Rights
restrictedAccess
License
http://purl.org/coar/access_right/c_16ec
Description
Summary:A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes until 2 μm was measured.