Effect of additives on diffusion coefficient for cupric ions and kinematics viscosity in cuso4-h2so4 solution at 60°c

The effect of levelling and grain-refining agents on the diffusion coefficient of cupric ion was studied. Tests were performed using synthetic solutions with Cu2+ concentration and acidity similar to those of a copper electro-refining industrial electrolyte by means of rotating disc electrode (RDE)...

Full description

Autores:
Araneda-Hernández, Eugenia
Vergara-Gutierrez, Froilán
Pagliero-Neira, Antonio
Tipo de recurso:
Article of journal
Fecha de publicación:
2014
Institución:
Universidad Nacional de Colombia
Repositorio:
Universidad Nacional de Colombia
Idioma:
spa
OAI Identifier:
oai:repositorio.unal.edu.co:unal/52524
Acceso en línea:
https://repositorio.unal.edu.co/handle/unal/52524
http://bdigital.unal.edu.co/46870/
Palabra clave:
diffusion coefficient cupric ions
electrorefining copper
glue
thiourea
chloride.
Rights
openAccess
License
Atribución-NoComercial 4.0 Internacional