Effect of additives on diffusion coefficient for cupric ions and kinematics viscosity in cuso4-h2so4 solution at 60°c
The effect of levelling and grain-refining agents on the diffusion coefficient of cupric ion was studied. Tests were performed using synthetic solutions with Cu2+ concentration and acidity similar to those of a copper electro-refining industrial electrolyte by means of rotating disc electrode (RDE)...
- Autores:
-
Araneda-Hernández, Eugenia
Vergara-Gutierrez, Froilán
Pagliero-Neira, Antonio
- Tipo de recurso:
- Article of journal
- Fecha de publicación:
- 2014
- Institución:
- Universidad Nacional de Colombia
- Repositorio:
- Universidad Nacional de Colombia
- Idioma:
- spa
- OAI Identifier:
- oai:repositorio.unal.edu.co:unal/52524
- Acceso en línea:
- https://repositorio.unal.edu.co/handle/unal/52524
http://bdigital.unal.edu.co/46870/
- Palabra clave:
- diffusion coefficient cupric ions
electrorefining copper
glue
thiourea
chloride.
- Rights
- openAccess
- License
- Atribución-NoComercial 4.0 Internacional