Electrodeposition of nickel plates on copper substrates using PC y PRC
Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of th...
- Autores:
-
Aperador Chaparro, William Arnulfo
Vera López, Enrique
- Tipo de recurso:
- Article of investigation
- Fecha de publicación:
- 2007
- Institución:
- Escuela Colombiana de Ingeniería Julio Garavito
- Repositorio:
- Repositorio Institucional ECI
- Idioma:
- eng
- OAI Identifier:
- oai:repositorio.escuelaing.edu.co:001/2368
- Acceso en línea:
- https://repositorio.escuelaing.edu.co/handle/001/2368
https://www.scielo.br/j/rmat/i/2007.v12n4/
- Palabra clave:
- Galvanoplastia
Corriente continua
Materiales resistentes a la corrosión
Niquelado
Electroplating
Electric currents, direct
Corrosion resistant materials
Nickel-plating
Pulse Current (PC)
Pulse Reverse Current (PRC)
Nickel electrodeposition
Protection against corrosion
- Rights
- openAccess
- License
- https://creativecommons.org/licenses/by-nc-nd/4.0/
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| dc.title.eng.fl_str_mv |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| title |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| spellingShingle |
Electrodeposition of nickel plates on copper substrates using PC y PRC Galvanoplastia Corriente continua Materiales resistentes a la corrosión Niquelado Electroplating Electric currents, direct Corrosion resistant materials Nickel-plating Pulse Current (PC) Pulse Reverse Current (PRC) Nickel electrodeposition Protection against corrosion |
| title_short |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| title_full |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| title_fullStr |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| title_full_unstemmed |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| title_sort |
Electrodeposition of nickel plates on copper substrates using PC y PRC |
| dc.creator.fl_str_mv |
Aperador Chaparro, William Arnulfo Vera López, Enrique |
| dc.contributor.author.none.fl_str_mv |
Aperador Chaparro, William Arnulfo Vera López, Enrique |
| dc.contributor.researchgroup.spa.fl_str_mv |
Grupo de Investigación Ecitrónica |
| dc.subject.armarc.spa.fl_str_mv |
Galvanoplastia Corriente continua Materiales resistentes a la corrosión Niquelado |
| topic |
Galvanoplastia Corriente continua Materiales resistentes a la corrosión Niquelado Electroplating Electric currents, direct Corrosion resistant materials Nickel-plating Pulse Current (PC) Pulse Reverse Current (PRC) Nickel electrodeposition Protection against corrosion |
| dc.subject.armarc.eng.fl_str_mv |
Electroplating Electric currents, direct Corrosion resistant materials Nickel-plating |
| dc.subject.proposal.eng.fl_str_mv |
Pulse Current (PC) Pulse Reverse Current (PRC) Nickel electrodeposition Protection against corrosion |
| description |
Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of the parameters involved. This research evaluates the influence of cathodic time (ton), anodic time (trev), relaxation time (toff), and voltage on the resistance to corrosion of nickel deposits using the PC and PRC techniques. Test were conducted in a dynamic manner, employing a rotating system with Watt’s solutions as the electrolyte and copper substrate electrodeposited on zamak as cathodes. Measurement of the grain size was conducted using Atomic Force Microscopy. Protection level against corrosion was evaluated by polarization curves and Electrochemical Impedance Spectroscopy. Important results include the formation of uniform deposits showing fine grain and excellent protection against corrosion. |
| publishDate |
2007 |
| dc.date.issued.none.fl_str_mv |
2007 |
| dc.date.accessioned.none.fl_str_mv |
2023-05-26T16:20:52Z |
| dc.date.available.none.fl_str_mv |
2023-05-26T16:20:52Z |
| dc.type.spa.fl_str_mv |
Artículo de revista |
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http://purl.org/coar/version/c_970fb48d4fbd8a85 |
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info:eu-repo/semantics/publishedVersion |
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http://purl.org/coar/resource_type/c_2df8fbb1 |
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Text |
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info:eu-repo/semantics/article |
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http://purl.org/redcol/resource_type/ART |
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http://purl.org/coar/resource_type/c_2df8fbb1 |
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publishedVersion |
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1517-7076 |
| dc.identifier.uri.none.fl_str_mv |
https://repositorio.escuelaing.edu.co/handle/001/2368 |
| dc.identifier.doi.eng.fl_str_mv |
10.1590/S1517-70762007000400006 |
| dc.identifier.url.none.fl_str_mv |
https://www.scielo.br/j/rmat/i/2007.v12n4/ |
| identifier_str_mv |
1517-7076 10.1590/S1517-70762007000400006 |
| url |
https://repositorio.escuelaing.edu.co/handle/001/2368 https://www.scielo.br/j/rmat/i/2007.v12n4/ |
| dc.language.iso.spa.fl_str_mv |
eng |
| language |
eng |
| dc.relation.citationendpage.spa.fl_str_mv |
588 |
| dc.relation.citationissue.spa.fl_str_mv |
4 |
| dc.relation.citationstartpage.spa.fl_str_mv |
583 |
| dc.relation.citationvolume.spa.fl_str_mv |
12 |
| dc.relation.indexed.spa.fl_str_mv |
N/A |
| dc.relation.ispartofjournal.eng.fl_str_mv |
Revista Matéria |
| dc.relation.references.spa.fl_str_mv |
KENNEETH GRAHAM, A., Electroplating engineering handbook, 2 ed. New York, Reinhold Publishing 1967. BARD, A.J., FAULKNER, L.R., Electrochemical methods, New York,John Wiley & Sons, 1980. BLUM, W., HOGABOOM, G.B., Galvanotecnia y galvanoplastia, 3 ed. México Compañía editorial continental S.A., 1986. FELDSTEIN, “N composite electroless plating”, Journal of Electrochemical, v. 39, n. 2, pp. 62-67, 1994. GLENN, M.O., “The fundamental aspects of electroless nickel plating”, Journal of Electrochemical, v. 45, pp. 136-139, 1997. LANGFORD, K., Análisis de baños electrolíticos, 1 ed. Madrid. Editorial Aguilar,1963. JELENA, B.B., “Electrochemical deposition and characterization of zinc-nickel alloys by direct and pulse current”, Journal of university of Belgrade, v. 2, n. 1. Pp. 32-39, 2002. MOLER, J.B., Electroplating for the metallurgy, engineer and chemist, Estates Unites, Chemical publications, 1951. MANDICH, N.V., Pulse and pulse-reverse electroplating, New York HBM Engineering Co., 1998. MISHRA, R., BALASUBRAMANIAM, R, Corrosion Science, v.6, PP. 46-49, 2003. |
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https://creativecommons.org/licenses/by-nc-nd/4.0/ |
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info:eu-repo/semantics/openAccess |
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Atribución-NoComercial-SinDerivadas 4.0 Internacional (CC BY-NC-ND 4.0) |
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https://creativecommons.org/licenses/by-nc-nd/4.0/ Atribución-NoComercial-SinDerivadas 4.0 Internacional (CC BY-NC-ND 4.0) http://purl.org/coar/access_right/c_abf2 |
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openAccess |
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6 páginas |
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application/pdf |
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Brasil |
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https://www.scielo.br/j/rmat/i/2007.v12n4/ |
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Escuela Colombiana de Ingeniería Julio Garavito |
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Aperador Chaparro, William Arnulfod0ab25696c12a7e94a910bc7647be528600Vera López, Enrique62ea7ee84bb14ffebacc75f0745d92b7600Grupo de Investigación Ecitrónica2023-05-26T16:20:52Z2023-05-26T16:20:52Z20071517-7076https://repositorio.escuelaing.edu.co/handle/001/236810.1590/S1517-70762007000400006https://www.scielo.br/j/rmat/i/2007.v12n4/Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of the parameters involved. This research evaluates the influence of cathodic time (ton), anodic time (trev), relaxation time (toff), and voltage on the resistance to corrosion of nickel deposits using the PC and PRC techniques. Test were conducted in a dynamic manner, employing a rotating system with Watt’s solutions as the electrolyte and copper substrate electrodeposited on zamak as cathodes. Measurement of the grain size was conducted using Atomic Force Microscopy. Protection level against corrosion was evaluated by polarization curves and Electrochemical Impedance Spectroscopy. Important results include the formation of uniform deposits showing fine grain and excellent protection against corrosion.Los procesos de electrodeposición por corriente continua (CC) requieren el uso de aditivos para controlar la estructura y las propiedades de los depósitos, así como la distribución de la corriente. Las técnicas de Corriente Pulsada (CP) y Corriente Pulsada Inversa (CPI) mejoran las propiedades de los depósitos a partir de una adecuada selección de los parámetros implicados. Esta investigación evalúa la influencia del tiempo catódico (ton), el tiempo anódico (trev), el tiempo de relajación (toff) y el voltaje en la resistencia a la corrosión de los depósitos de níquel utilizando las técnicas de PC y PRC. Los ensayos se realizaron de forma dinámica, empleando un sistema rotatorio con soluciones de Watt como electrolito y sustrato de cobre electrodepositado sobre zamak como cátodos. La medición del tamaño de grano se realizó mediante microscopía de fuerza atómica. El nivel de protección contra la corrosión se evaluó mediante curvas de polarización y Espectroscopía de Impedancia Electroquímica. Entre los resultados obtenidos cabe destacar la formación de depósitos uniformes de grano fino y una excelente protección contra la corrosión.6 páginasapplication/pdfenghttps://creativecommons.org/licenses/by-nc-nd/4.0/info:eu-repo/semantics/openAccessAtribución-NoComercial-SinDerivadas 4.0 Internacional (CC BY-NC-ND 4.0)http://purl.org/coar/access_right/c_abf2https://www.scielo.br/j/rmat/i/2007.v12n4/Electrodeposition of nickel plates on copper substrates using PC y PRCArtículo de revistainfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_2df8fbb1Textinfo:eu-repo/semantics/articlehttp://purl.org/redcol/resource_type/ARThttp://purl.org/coar/version/c_970fb48d4fbd8a85Brasil588458312N/ARevista MatériaKENNEETH GRAHAM, A., Electroplating engineering handbook, 2 ed. New York, Reinhold Publishing 1967.BARD, A.J., FAULKNER, L.R., Electrochemical methods, New York,John Wiley & Sons, 1980.BLUM, W., HOGABOOM, G.B., Galvanotecnia y galvanoplastia, 3 ed. México Compañía editorial continental S.A., 1986.FELDSTEIN, “N composite electroless plating”, Journal of Electrochemical, v. 39, n. 2, pp. 62-67, 1994.GLENN, M.O., “The fundamental aspects of electroless nickel plating”, Journal of Electrochemical, v. 45, pp. 136-139, 1997.LANGFORD, K., Análisis de baños electrolíticos, 1 ed. Madrid. Editorial Aguilar,1963.JELENA, B.B., “Electrochemical deposition and characterization of zinc-nickel alloys by direct and pulse current”, Journal of university of Belgrade, v. 2, n. 1. Pp. 32-39, 2002.MOLER, J.B., Electroplating for the metallurgy, engineer and chemist, Estates Unites, Chemical publications, 1951.MANDICH, N.V., Pulse and pulse-reverse electroplating, New York HBM Engineering Co., 1998.MISHRA, R., BALASUBRAMANIAM, R, Corrosion Science, v.6, PP. 46-49, 2003.GalvanoplastiaCorriente continuaMateriales resistentes a la corrosiónNiqueladoElectroplatingElectric currents, directCorrosion resistant materialsNickel-platingPulse Current (PC)Pulse Reverse Current (PRC)Nickel electrodepositionProtection against corrosionTHUMBNAILElectrodeposition of nickel plates on copper substrates using PC y PRC.pdf.jpgElectrodeposition of nickel plates on copper substrates using PC y PRC.pdf.jpgGenerated Thumbnailimage/jpeg14718https://repositorio.escuelaing.edu.co/bitstream/001/2368/4/Electrodeposition%20of%20nickel%20plates%20on%20copper%20substrates%20using%20PC%20y%20PRC.pdf.jpg740d25a80add5b077fd6cea79e213242MD54open accessTEXTElectrodeposition of nickel plates on copper substrates using PC y PRC.pdf.txtElectrodeposition of nickel plates on copper substrates using PC y PRC.pdf.txtExtracted texttext/plain14267https://repositorio.escuelaing.edu.co/bitstream/001/2368/3/Electrodeposition%20of%20nickel%20plates%20on%20copper%20substrates%20using%20PC%20y%20PRC.pdf.txt280d7d4c3018ca9e769f974e13436e9fMD53open accessLICENSElicense.txtlicense.txttext/plain; charset=utf-81881https://repositorio.escuelaing.edu.co/bitstream/001/2368/2/license.txt5a7ca94c2e5326ee169f979d71d0f06eMD52open accessORIGINALElectrodeposition of nickel plates on copper substrates using PC y PRC.pdfElectrodeposition of nickel plates on copper substrates using PC y PRC.pdfArtículo de revistaapplication/pdf278027https://repositorio.escuelaing.edu.co/bitstream/001/2368/1/Electrodeposition%20of%20nickel%20plates%20on%20copper%20substrates%20using%20PC%20y%20PRC.pdf8c35934502fff5cc5eb4b661822ab418MD51open access001/2368oai:repositorio.escuelaing.edu.co:001/23682023-10-06 15:09:27.62open accessRepositorio Escuela Colombiana de Ingeniería Julio Garavitorepositorio.eci@escuelaing.edu.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 |