Electrodeposition of nickel plates on copper substrates using PC y PRC
Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of th...
- Autores:
-
Aperador Chaparro, William Arnulfo
Vera López, Enrique
- Tipo de recurso:
- Article of investigation
- Fecha de publicación:
- 2007
- Institución:
- Escuela Colombiana de Ingeniería Julio Garavito
- Repositorio:
- Repositorio Institucional ECI
- Idioma:
- eng
- OAI Identifier:
- oai:repositorio.escuelaing.edu.co:001/2368
- Acceso en línea:
- https://repositorio.escuelaing.edu.co/handle/001/2368
https://www.scielo.br/j/rmat/i/2007.v12n4/
- Palabra clave:
- Galvanoplastia
Corriente continua
Materiales resistentes a la corrosión
Niquelado
Electroplating
Electric currents, direct
Corrosion resistant materials
Nickel-plating
Pulse Current (PC)
Pulse Reverse Current (PRC)
Nickel electrodeposition
Protection against corrosion
- Rights
- openAccess
- License
- https://creativecommons.org/licenses/by-nc-nd/4.0/