Technology management. Design and manufacture of a heatsink

ilustraciones, diagramas

Autores:: Montesinos-González, Salvador
Vázquez-Cid-de León, Carlos
Domínguez-Herrera, José Ernesto
Palafox-Alvarado, Gerardo Israel

Tipo de recurso:: Article of journal

Fecha de publicación:: 2023

Institución:: Universidad Nacional de Colombia

Repositorio:: Universidad Nacional de Colombia

Idioma:: eng

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dc.title.eng.fl_str_mv	Technology management. Design and manufacture of a heatsink
dc.title.translated.none.fl_str_mv	Gestión Tecnológica. Diseño y manufactura de un disipador de calor
title	Technology management. Design and manufacture of a heatsink
spellingShingle	Technology management. Design and manufacture of a heatsink 620 - Ingeniería y operaciones afines::629 - Otras ramas de la ingeniería Management Desing Manufacture Convention Heatsink Gestión Diseño Manufactura Disipador de calor Convención
title_short	Technology management. Design and manufacture of a heatsink
title_full	Technology management. Design and manufacture of a heatsink
title_fullStr	Technology management. Design and manufacture of a heatsink
title_full_unstemmed	Technology management. Design and manufacture of a heatsink
title_sort	Technology management. Design and manufacture of a heatsink
dc.creator.fl_str_mv	Montesinos-González, Salvador Vázquez-Cid-de León, Carlos Domínguez-Herrera, José Ernesto Palafox-Alvarado, Gerardo Israel
dc.contributor.author.none.fl_str_mv	Montesinos-González, Salvador Vázquez-Cid-de León, Carlos Domínguez-Herrera, José Ernesto Palafox-Alvarado, Gerardo Israel
dc.subject.ddc.spa.fl_str_mv	620 - Ingeniería y operaciones afines::629 - Otras ramas de la ingeniería
topic	620 - Ingeniería y operaciones afines::629 - Otras ramas de la ingeniería Management Desing Manufacture Convention Heatsink Gestión Diseño Manufactura Disipador de calor Convención
dc.subject.proposal.eng.fl_str_mv	Management Desing Manufacture Convention Heatsink
dc.subject.proposal.spa.fl_str_mv	Gestión Diseño Manufactura Disipador de calor Convención
description	ilustraciones, diagramas
publishDate	2023
dc.date.accessioned.none.fl_str_mv	2023-06-27T17:02:55Z
dc.date.available.none.fl_str_mv	2023-06-27T17:02:55Z
dc.date.issued.none.fl_str_mv	2023-04
dc.type.spa.fl_str_mv	Artículo de revista
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dc.relation.references.spa.fl_str_mv	[1]Harper, C.A., Electronic Packaging and Interconnection Handbook. 4th ed., McGraw-Hill, New York, 2005, pp. 50-61 [2]Bar-Cohen, A., Wang, P. and Rahim, E., Thermal Management of high heat flux nanoelectronic chips. Z-Tec Publishing, Bremen Microgravity Science and Technology, 19(3), pp. 48-52, 2007. DOI: https://doi.org/10.1007/BF02915748 [3]Chitode, J.S., Industrial Electronics. 1st ed., India: Technical Publications, 2009, pp. 80-114. [4]Šprlák, R., Kalvar, D. and Chlebiš, P., Design of experimental liquid heat sink for high power electronic. 14th International Conference on Environment and Electrical Engineering, pp. 83-105, 2014. DOI: https://doi.org/10.1007/978-90-481-9029-4_5 [5]Thome, J. and Consolini, L., Prediction of critical flux in microchannels. Microfluidics Based Microsystems: Fundamentals and applications, pp. 107-120, 2010. DOI: https://doi.org/10.1007/978-90- 481-9029-4_6 [6]Dang, T., Teng, J.T. and Chu, J.C., A study on the simulation and experiment of a microchannel counterflow. Applied Thermal Engineering, 30(14), pp. 2163-2172, 2010. DOI: https://doi.org/10.1016/j.applthermaleng.2010.05.029 [7]Kosar, A., Effect of substrate thickness and material on heat transfer. International Journal of Thermal Sciences, 49(4), pp. 635-642, 2009. DOI:https://doi.org/10.1016/j.ijthermalsci.2009.11.004 [8]Seal, S., Glover, M. and Mantooth, H.A., Design of a Reduced form factor passive heat sink for high power applications, IEEE International Workshop on Integrated Power Packaging (IWIPP), pp. 44-47, 2015. DOI: https://doi.org/10.1109/IWIPP.2015.7295974 [9]Steiner, T. and Sittig, R., IGBT Module Setup with Integrated Micro-Heat Sinks. IEEE 12th International Symposium on Power Semiconductor Devices and ICs. Proceedings (Cat. No. 00CH37094, pp.209-212, 2000. DOI: https://doi.org/10.1109/ISPSD.2000.856808 [10]Holman, J.P., Heat transfer. 10th ed. McGraw-Hill, New York, 2009, pp. 190-215. [11]Christen, D., Member, S., Stojadinovic, M., Member, S. and Senior, J.B., Energy Efficient Heat Sink Design: Natural vs Forced Convection Cooling, IEEE Transactions on Power Electronics, 32(11), pp.8693-8704, 2016. DOI: https://doi.org/10.1109/TPEL.2016.2640454 [12]Han, M., Leet, S., Hong, C., Yang, C. and Kim, K., Development of water-cooled heat sink for high-power IGBT inverter, IEEE 7ª International Conference on Power Electronics, 2008, pp. 295-299. DOI: https://doi.org/10.1109/ICPE.2007.4692396 [13]Robinson, A.J., A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling, IEEE Transactions on Components and Packaging Technologies, 32(2), pp. 347-357, 2009. DOI: https://doi.org/10.1109/TCAPT.2008.2010408 [14]Gillot, C., Meysenc, L., Schaeffer, C. and Bricard, A., Integrated single and two-phase micro heat sinks under IGBT chips, IEEE Transactions on Components and Packaging Technologies, 22(3), 1999. DOI: https://doi.org/10.1109/6144.796540 [15]Marinov, A. and Georgiev, A., Modelling, Analysis and comparison of heat sink designs with improved natural convection, in: IEEE 19th International Symposium on Electrical Apparatus and Technologies (SIELA), 2016, pp. 1-4, DOI: https://doi.org/10.1109/SIELA.2016.7543023 [16]Zainolarifin, M., Hanafi, M., Ismail, F.S. and Rosli, R., Radial plate fins heat sink model design and optimization, in: IEEE 10th Asian Control Conference (ASCC), 2015, pp 1-5. DOI: https://doi.org/10.1109/ASCC.2015.7244448 [17]Asimakopoulos, P., Papastergiou, K., Thiringer, T. and Bongiorno, M., Heat sink design considerations in medium power electronic applications with long power cycles, in: IEEE 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe), 2015, pp. 1-9. DOI: https://doi.org/10.1109/EPE.2015.7309150 [18]Welker, T. and Müller, J., Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels, IN: 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, pp. 830-385. DOI: https://doi.org/10.1109/ITHERM.2016.7517632 [19]Manivannan, S., Prasanna, S., Arumugam, R. and Sudharsan, N.M., Multi-objective optimization of flat plate heat sink. International Journal of Advanced Manufacturing Technolgy, 52, pp. 739-749, 2010. DOI: https://doi.org/10.1007/s00170-010-2754-8 [20]Popovic, J., Milanovic, M., Dolinar, D. and Klopcic, B., Thermal analysis of the half-bridge IGBT power module with analytical, numerical and experimental methods. Przeglad Electrotechniczny (Electrical Review), 87(3), pp.145-148, 2011. [21]Pugh, S., Total design: integrated methods for successful product engineering. 1st ed., Addison Wesley, E.U., 1991, pp. 20-25. [22]Palafox, G.I., Design and manufacturing of a heat sink for IGBT power transistors. Thesis MSc, Technological University of the Mixteca, Huajuapan de León, Oax., Mexico, 2017, pp. 10-60. [23]Bergman, T., Lavine, A., Incropera, F. and DeWitt, D.,Fundamentals of heat and mass transfer. 7th ed., Wiley, E.U.,2011, pp. 30-32. [24]Groover, M., Fundamentals of Modern Manufacturing:Materials, Processes, and Systems. 5th ed., Mc Graw-Hill, E.U., 2012, pp. 30-32. [25]Kalpakjian, S. and Schmid, S.R., Manufacturing Engineeringand Technology. 7th ed., Prentice Hall, E.U., 2014, pp. 57-59
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dc.publisher.spa.fl_str_mv	Universidad Nacional de Colombia
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dc.publisher.place.spa.fl_str_mv	Medellín, Colombia
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spelling	Atribución-NoComercial-SinDerivadas 4.0 Internacionalhttp://creativecommons.org/licenses/by-nc-nd/4.0/info:eu-repo/semantics/openAccesshttp://purl.org/coar/access_right/c_abf2Montesinos-González, Salvador79a1d9ff2fddd5c7a73ffe0e36b09a87Vázquez-Cid-de León, Carlose3594f1a32d75d682e16b6fc2679198aDomínguez-Herrera, José Ernesto52aebf4aec7c7fe63aa8abc3101e20c3Palafox-Alvarado, Gerardo Israelf9c791be9661a5c9cf301a8e59f4aac12023-06-27T17:02:55Z2023-06-27T17:02:55Z2023-04ISSN 0012-7353https://repositorio.unal.edu.co/handle/unal/84084ISSN 2346-2183Universidad Nacional de ColombiaRepositorio Institucional Universidad Nacional de Colombiahttps://repositorio.unal.edu.co/ilustraciones, diagramasThe main purpose of this research is to study and analyze the management of technology and innovation through the manufacture of a heatsink is manufactured for IGBT power transistors to fit a CD/CD converter. This work consists of four stages: planning, design, modelling and manufacturing. It is assumed that the manufacture of an innovative product requires guaranteeing customer satisfaction, like functional criteria (requirements) were defined like in decrease the temperature to less than 50 °C, heat dissipation is realised by natural convection or forced convection. Non-functional criteria, like easy transport with a weightless than 2.5 kg, dimensions less than 0.32 m long, 0.217 m wide and 0.09 cm high. Besides, the conditioned material is copper or aluminium or the use of both. To achieve this, Pugh's methodology was used.El objetivo principal de esta investigación es estudiar y analizar la gestión de la tecnología y la innovación a través de la fabricación de un disipador térmico para transistores de potencia IGBT que se adapten a un convertidor CD/CD. Este trabajo consta de cuatro etapas: planificación, diseño, modelado y fabricación. Se asume que la fabricación de un producto innovador requiere garantizar la satisfacción del cliente, ya que se definieron criterios funcionales (requisitos) como en disminuir la temperatura a menos de 50 ° C, la disipación de calor se realiza por convección natural o convección forzada. Criterios no funcionales, como fácil transporte con un peso inferior a 2,5 kg. dimensiones inferiores a 0,32 m de largo, 0,217 m de ancho y 0,09 cm de alto. Además, el material acondicionado es cobre o aluminio o el uso de ambos. Para lograrlo, se utilizó la metodología de Pugh. (Texto tomado de la fuente)Received: August 8th, 2022. Received in revised form: January 11th, 2023. Accepted: January 13th, 20238 páginasapplication/pdfengUniversidad Nacional de ColombiaArtículos de RevistasMedellín, Colombiahttps://revistas.unal.edu.co/index.php/dyna/article/view/104063/88607620 - Ingeniería y operaciones afines::629 - Otras ramas de la ingenieríaManagementDesingManufactureConventionHeatsinkGestiónDiseñoManufacturaDisipador de calorConvenciónTechnology management. Design and manufacture of a heatsinkGestión Tecnológica. Diseño y manufactura de un disipador de calorArtículo de revistainfo:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501http://purl.org/coar/resource_type/c_2df8fbb1http://purl.org/coar/version/c_970fb48d4fbd8a85Texthttp://purl.org/redcol/resource_type/ARTOTR226 (Abril-junio 2023)16226990RedColLaReferenciaDYNA[1]Harper, C.A., Electronic Packaging and Interconnection Handbook. 4th ed., McGraw-Hill, New York, 2005, pp. 50-61[2]Bar-Cohen, A., Wang, P. and Rahim, E., Thermal Management of high heat flux nanoelectronic chips. Z-Tec Publishing, Bremen Microgravity Science and Technology, 19(3), pp. 48-52, 2007. DOI: https://doi.org/10.1007/BF02915748[3]Chitode, J.S., Industrial Electronics. 1st ed., India: Technical Publications, 2009, pp. 80-114.[4]Šprlák, R., Kalvar, D. and Chlebiš, P., Design of experimental liquid heat sink for high power electronic. 14th International Conference on Environment and Electrical Engineering, pp. 83-105, 2014. DOI: https://doi.org/10.1007/978-90-481-9029-4_5[5]Thome, J. and Consolini, L., Prediction of critical flux in microchannels. Microfluidics Based Microsystems: Fundamentals and applications, pp. 107-120, 2010. DOI: https://doi.org/10.1007/978-90- 481-9029-4_6[6]Dang, T., Teng, J.T. and Chu, J.C., A study on the simulation and experiment of a microchannel counterflow. Applied Thermal Engineering, 30(14), pp. 2163-2172, 2010. DOI: https://doi.org/10.1016/j.applthermaleng.2010.05.029[7]Kosar, A., Effect of substrate thickness and material on heat transfer. International Journal of Thermal Sciences, 49(4), pp. 635-642, 2009. DOI:https://doi.org/10.1016/j.ijthermalsci.2009.11.004[8]Seal, S., Glover, M. and Mantooth, H.A., Design of a Reduced form factor passive heat sink for high power applications, IEEE International Workshop on Integrated Power Packaging (IWIPP), pp. 44-47, 2015. DOI: https://doi.org/10.1109/IWIPP.2015.7295974[9]Steiner, T. and Sittig, R., IGBT Module Setup with Integrated Micro-Heat Sinks. IEEE 12th International Symposium on Power Semiconductor Devices and ICs. Proceedings (Cat. No. 00CH37094, pp.209-212, 2000. DOI: https://doi.org/10.1109/ISPSD.2000.856808[10]Holman, J.P., Heat transfer. 10th ed. McGraw-Hill, New York, 2009, pp. 190-215.[11]Christen, D., Member, S., Stojadinovic, M., Member, S. and Senior, J.B., Energy Efficient Heat Sink Design: Natural vs Forced Convection Cooling, IEEE Transactions on Power Electronics, 32(11), pp.8693-8704, 2016. DOI: https://doi.org/10.1109/TPEL.2016.2640454[12]Han, M., Leet, S., Hong, C., Yang, C. and Kim, K., Development of water-cooled heat sink for high-power IGBT inverter, IEEE 7ª International Conference on Power Electronics, 2008, pp. 295-299. DOI: https://doi.org/10.1109/ICPE.2007.4692396[13]Robinson, A.J., A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling, IEEE Transactions on Components and Packaging Technologies, 32(2), pp. 347-357, 2009. DOI: https://doi.org/10.1109/TCAPT.2008.2010408[14]Gillot, C., Meysenc, L., Schaeffer, C. and Bricard, A., Integrated single and two-phase micro heat sinks under IGBT chips, IEEE Transactions on Components and Packaging Technologies, 22(3), 1999. DOI: https://doi.org/10.1109/6144.796540[15]Marinov, A. and Georgiev, A., Modelling, Analysis and comparison of heat sink designs with improved natural convection, in: IEEE 19th International Symposium on Electrical Apparatus and Technologies (SIELA), 2016, pp. 1-4, DOI: https://doi.org/10.1109/SIELA.2016.7543023[16]Zainolarifin, M., Hanafi, M., Ismail, F.S. and Rosli, R., Radial plate fins heat sink model design and optimization, in: IEEE 10th Asian Control Conference (ASCC), 2015, pp 1-5. DOI: https://doi.org/10.1109/ASCC.2015.7244448[17]Asimakopoulos, P., Papastergiou, K., Thiringer, T. and Bongiorno, M., Heat sink design considerations in medium power electronic applications with long power cycles, in: IEEE 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe), 2015, pp. 1-9. DOI: https://doi.org/10.1109/EPE.2015.7309150[18]Welker, T. and Müller, J., Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels, IN: 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, pp. 830-385. DOI: https://doi.org/10.1109/ITHERM.2016.7517632[19]Manivannan, S., Prasanna, S., Arumugam, R. and Sudharsan, N.M., Multi-objective optimization of flat plate heat sink. International Journal of Advanced Manufacturing Technolgy, 52, pp. 739-749, 2010. DOI: https://doi.org/10.1007/s00170-010-2754-8[20]Popovic, J., Milanovic, M., Dolinar, D. and Klopcic, B., Thermal analysis of the half-bridge IGBT power module with analytical, numerical and experimental methods. Przeglad Electrotechniczny (Electrical Review), 87(3), pp.145-148, 2011.[21]Pugh, S., Total design: integrated methods for successful product engineering. 1st ed., Addison Wesley, E.U., 1991, pp. 20-25.[22]Palafox, G.I., Design and manufacturing of a heat sink for IGBT power transistors. Thesis MSc, Technological University of the Mixteca, Huajuapan de León, Oax., Mexico, 2017, pp. 10-60.[23]Bergman, T., Lavine, A., Incropera, F. and DeWitt, D.,Fundamentals of heat and mass transfer. 7th ed., Wiley, E.U.,2011, pp. 30-32.[24]Groover, M., Fundamentals of Modern Manufacturing:Materials, Processes, and Systems. 5th ed., Mc Graw-Hill, E.U., 2012, pp. 30-32.[25]Kalpakjian, S. and Schmid, S.R., Manufacturing Engineeringand Technology. 7th ed., Prentice Hall, E.U., 2014, pp. 57-59Público generalORIGINALTECHNOLOGY MANAGEMENT. DESIGN AND MANUFACTURE OF A HEATSINK.pdfTECHNOLOGY MANAGEMENT. 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Technology management. Design and manufacture of a heatsink

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