Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja
Ilustraciones
- Autores:
-
Fandiño Toro, Hermes Alexander
- Tipo de recurso:
- Doctoral thesis
- Fecha de publicación:
- 2021
- Institución:
- Universidad Nacional de Colombia
- Repositorio:
- Universidad Nacional de Colombia
- Idioma:
- spa
- OAI Identifier:
- oai:repositorio.unal.edu.co:unal/79684
- Palabra clave:
- 000 - Ciencias de la computación, información y obras generales::003 - Sistemas
620 - Ingeniería y operaciones afines
Termografía
Esfuerzo térmico
Fotoelasticidad
Termografía infrarroja
Termoelasticidad
Campo de esfuerzos
Procesamiento digital de imágenes
Desplazamiento de franjas
Photoelasticity
Infrared thermography
Stress field
Digital image processing
Fringe pattern displacement
- Rights
- openAccess
- License
- Atribución-NoComercial-SinDerivadas 4.0 Internacional
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dc.title.spa.fl_str_mv |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
dc.title.translated.eng.fl_str_mv |
Analysis oriented towards visual inspection based on photoelasticity and infrared thermography |
title |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
spellingShingle |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja 000 - Ciencias de la computación, información y obras generales::003 - Sistemas 620 - Ingeniería y operaciones afines Termografía Esfuerzo térmico Fotoelasticidad Termografía infrarroja Termoelasticidad Campo de esfuerzos Procesamiento digital de imágenes Desplazamiento de franjas Photoelasticity Infrared thermography Stress field Digital image processing Fringe pattern displacement |
title_short |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
title_full |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
title_fullStr |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
title_full_unstemmed |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
title_sort |
Análisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarroja |
dc.creator.fl_str_mv |
Fandiño Toro, Hermes Alexander |
dc.contributor.advisor.none.fl_str_mv |
Branch Bedoya, John William Restrepo Martinez, Alejandro |
dc.contributor.author.none.fl_str_mv |
Fandiño Toro, Hermes Alexander |
dc.contributor.researchgroup.spa.fl_str_mv |
GIDIA: Grupo de Investigación y Desarrollo en Inteligencia Artificial GPIMA: Grupo de Promoción e Investigación en Mecánica Aplicada |
dc.subject.ddc.spa.fl_str_mv |
000 - Ciencias de la computación, información y obras generales::003 - Sistemas 620 - Ingeniería y operaciones afines |
topic |
000 - Ciencias de la computación, información y obras generales::003 - Sistemas 620 - Ingeniería y operaciones afines Termografía Esfuerzo térmico Fotoelasticidad Termografía infrarroja Termoelasticidad Campo de esfuerzos Procesamiento digital de imágenes Desplazamiento de franjas Photoelasticity Infrared thermography Stress field Digital image processing Fringe pattern displacement |
dc.subject.lemb.none.fl_str_mv |
Termografía Esfuerzo térmico |
dc.subject.proposal.spa.fl_str_mv |
Fotoelasticidad Termografía infrarroja Termoelasticidad Campo de esfuerzos Procesamiento digital de imágenes Desplazamiento de franjas |
dc.subject.proposal.eng.fl_str_mv |
Photoelasticity Infrared thermography Stress field Digital image processing Fringe pattern displacement |
description |
Ilustraciones |
publishDate |
2021 |
dc.date.accessioned.none.fl_str_mv |
2021-06-23T14:13:09Z |
dc.date.available.none.fl_str_mv |
2021-06-23T14:13:09Z |
dc.date.issued.none.fl_str_mv |
2021-06-21 |
dc.type.spa.fl_str_mv |
Trabajo de grado - Doctorado |
dc.type.driver.spa.fl_str_mv |
info:eu-repo/semantics/doctoralThesis |
dc.type.version.spa.fl_str_mv |
info:eu-repo/semantics/acceptedVersion |
dc.type.coar.spa.fl_str_mv |
http://purl.org/coar/resource_type/c_db06 |
dc.type.content.spa.fl_str_mv |
Text |
dc.type.redcol.spa.fl_str_mv |
http://purl.org/redcol/resource_type/TD |
format |
http://purl.org/coar/resource_type/c_db06 |
status_str |
acceptedVersion |
dc.identifier.uri.none.fl_str_mv |
https://repositorio.unal.edu.co/handle/unal/79684 |
dc.identifier.instname.spa.fl_str_mv |
Universidad Nacional de Colombia |
dc.identifier.reponame.spa.fl_str_mv |
Repositorio Institucional Universidad Nacional de Colombia |
dc.identifier.repourl.spa.fl_str_mv |
https://repositorio.unal.edu.co/ |
url |
https://repositorio.unal.edu.co/handle/unal/79684 https://repositorio.unal.edu.co/ |
identifier_str_mv |
Universidad Nacional de Colombia Repositorio Institucional Universidad Nacional de Colombia |
dc.language.iso.spa.fl_str_mv |
spa |
language |
spa |
dc.relation.references.spa.fl_str_mv |
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Atribución-NoComercial-SinDerivadas 4.0 Internacionalhttp://creativecommons.org/licenses/by-nc-nd/4.0/info:eu-repo/semantics/openAccesshttp://purl.org/coar/access_right/c_abf2Branch Bedoya, John William7e38ec86da58a9547c188086b39efee8600Restrepo Martinez, Alejandroc38fd71e89a4f975138c9d1a6f368978600Fandiño Toro, Hermes Alexander0ce7c35b931080bb87b65c981c239f76GIDIA: Grupo de Investigación y Desarrollo en Inteligencia ArtificialGPIMA: Grupo de Promoción e Investigación en Mecánica Aplicada2021-06-23T14:13:09Z2021-06-23T14:13:09Z2021-06-21https://repositorio.unal.edu.co/handle/unal/79684Universidad Nacional de ColombiaRepositorio Institucional Universidad Nacional de Colombiahttps://repositorio.unal.edu.co/IlustracionesLa fotoelasticidad es una técnica de inspección visual para determinar el campo de esfuerzos de un objeto bajo carga. A pesar de que permite análisis no invasivos, no destructivos y de campo completo, el desempeño de los estudios de fotoelasticidad depende de múltiples aspectos experimentales. Un aspecto clave es la generación de un conjunto de imágenes con patrones de franja, ya que el campo de esfuerzos se obtiene luego de procesar este conjunto de imágenes. Para que sea posible la evaluación del campo de esfuerzos, estos patrones de franja deben exhibir cierto grado de desplazamiento entre ellos, lo cual se logra modificando el estado de esfuerzos de la pieza bajo inspección. En esta tesis se evalúa la concentración de esfuerzos de modelos birrefringentes sometidos a carga mecánicas y térmicas. Esta evaluación se hace analizando cambios en las concentración de esfuerzos, al modificar la fuente de iluminación del polariscopio empleado; y mediante la estimulación térmica de los modelos birrefringentes bajo carga. Como resultado de analizar las interacciones entre desplazamientos de franja y temperatura, se logran tres estrategias para integrar fotoelasticidad y termografía infrarroja. Los resultados de los análisis efectuados en esta tesis son: (1) teóricamente es posible extender el análisis fotoelástico a espectro electromagnético infrarrojo, lo cual sería útil para tratar algunos problemas de sobremodulación que pueden ocurrir en el espectro visible; (2) se puede utilizar un único experimento de aplicación de carga cíclica, para determinar simultáneamente los campos de esfuerzos y de temperatura de un modelo birrefringente bajo carga; (3) se pueden integrar la fotoelasticidad y la termografía infrarroja, para determinar campos de esfuerzos de muestras birrefringentes bajo carga, incluso en aplicaciones estáticas. En este último caso, la termografía es útil para determinar la magnitud del estímulo térmico, que a su vez permita determinar el campo de esfuerzos de la muestra inspeccionada. (Tomado de la fuente)Digital photoelasticity is an imaging technique for visualizing the stress field of loaded objects. Despite their advantages over other techniques for stress analysis, photoelasticity-based studies are non-trivial to develop and, their effectiveness depends on several theoretical and experimental aspects, one being the generation of a proper set of images with fringe patterns displacements. This, because the processing of these images produces the required stress field. In this thesis, the fringe displacements at the surface of a loaded sample are modified by a thermal stimulation. After analyzing the interactions between fringe patterns displacements and temperature, three strategies to integrate photoelasticity and infrared thermography are proposed. The results of the analyzes carried out are: (1) theoretically it is possible to extend the photoelastic analysis to the infrared, which can help with some over modulation problems that can appear in the visible region of the electromagnetic spectrum; (2) a single experiment based on cyclic load can be used to simultaneously reconstruct the stress and temperature fields of a birefringent loaded sample and, (3) photoelasticity and infrared thermography can be integrated to calculate stress fields even in static applications. In the latter case, infrared thermography serves to determine the temperatures steps that, in turn, lead to obtaining the required stress field. (Tomado de la fuente)DoctoradoDoctor en IngenieríaTermografía Digital210 páginasapplication/pdfspaUniversidad Nacional de ColombiaMedellín - Minas - Doctorado en Ingeniería - SistemasDepartamento de la Computación y la DecisiónFacultad de MinasMedellínUniversidad Nacional de Colombia - Sede Medellín000 - Ciencias de la computación, información y obras generales::003 - Sistemas620 - Ingeniería y operaciones afinesTermografíaEsfuerzo térmicoFotoelasticidadTermografía infrarrojaTermoelasticidadCampo de esfuerzosProcesamiento digital de imágenesDesplazamiento de franjasPhotoelasticityInfrared thermographyStress fieldDigital image processingFringe pattern displacementAnálisis orientado hacia la inspección visual basado en fotoelasticidad y termografía infrarrojaAnalysis oriented towards visual inspection based on photoelasticity and infrared thermographyTrabajo de grado - Doctoradoinfo:eu-repo/semantics/doctoralThesisinfo:eu-repo/semantics/acceptedVersionhttp://purl.org/coar/resource_type/c_db06Texthttp://purl.org/redcol/resource_type/TDJ. 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