Computational fluid dynamicsmodeling of microchannels cooling for electronic microdevices

A simulation of the cooling of electronic devices was carried out by means of microchannels, using water as a coolant to dissipate the heat generated from a computer processor, and thus stabilize its optimum operating temperature. For the development of this study, computational fluid mechanics modeling was established in order to determine the temperature profiles, pressure profiles, and velocity behavior of the working fluid in the microchannel. In the results of the study, the operating temperatures of the computer processor were obtained, in the ranges of 303 K to 307 K, with fluid velocities in the microchannels of 5 m/s, apressure drop of 633.7 kPa, and a factor of safety of the design of the microchannel of 15. From the results, the improvement of the heat transfer in a cooling system of electronic deviceswas evidenced when using a coolant as a working fluid compared to the cooling by forced air flow traditional

• Autores: Fábregas, Jonathan; Santamaria, Henry; Buelvas, Edgardo; Perez, Saul; Díaz, Carlos; Carpintero Durango, Javier Andrés; Mendoza, Ricardo; Villa, Jennifer
• Tipo de recurso: Article of journal
• Fecha de publicación: 2022
• Institución: Corporación Universidad de la Costa
• Repositorio: REDICUC - Repositorio CUC
• Idioma: eng
• OAI Identifier: oai:repositorio.cuc.edu.co:11323/9286
• Acceso en línea: https://hdl.handle.net/11323/9286; https://doi.org/10.31436/iiumej.v23i1.2113; https://repositorio.cuc.edu.co/
• Palabra clave: Computational fluids dynamics; Microchannels; Processor; Cooling
• Rights: openAccess
• License: Atribución-NoComercial 4.0 Internacional (CC BY-NC 4.0)